埋盲孔   Blind and Buried vias          

Back Board

 厚銅箔   Thick copper              

Characteristic lmpedance

 局部硬金      Selective hard gold

plating   插頭鍍鎳金   Gold finger plating

表面塗覆Surface

finishing:

 化學沉金      Chemical immersion

gold     絲印藍膠    

silkscreen peelable mask

Chemical immersion silver              

 熱風整平      HASL

 整板鍍鎳金(水/軟金)  

Flash(soft)gold over nickel   化學沉錫    

Chemical immersion tin

 絲印碳油      Carbon print                       有機抗氧化膜      OSP

技術能力Technology

capability

 層數(shù)      Layers    1-20

 板材      Base material        FR4

 線差/線距     Conductor width/space         ≥0.1mm

 最大加工面稹      水金板  

Max Production Panel size    Gold pcb       508mmX610mm

 噴錫板   HAL PCB      460mmX610mm

 成品板厚      水金板  

Final Board thickness    Gold PCB      0.4mm-3.5mm

 噴錫板   HAL PCB      0.6mm-3.5mm

 翹曲度   Bow and twist       0.7%

 成品孔徑      Hole diameter of

final product     ≥0.25mm

 成品孔徑公差      Hole diameter

tolerance for final product    ±0.05mm

 外型尺寸公差      Profile tolerance    ±0.10mm

 阻焊橋?qū)挾?  Width of bridge with

sololer mask       ≥0.08mm

 阻焊塞孔能力      Solder mask plug via

size     0.3mm-0.8mm

 厚銅板   Thick copper products   3-50z

 孔內(nèi)銅厚度   Hole wall copper   ≥20μм